Method of matching two or more plasma reactors
作者： Gaurav Saraf , Bradley Scott Hersch , Wen Teh Chang , Xiawan Yang , Anisul H Khan
DOI:
关键词: Optics 、 Offset (computer science) 、 Materials science 、 Plasma 、 Electronic engineering
摘要: Etch rate distributions are captured at a succession of hardware tilt angles the RF source power applicator relative to workpiece and their non-uniformities computed, behavior is modeled as non-uniformity function for each one least two plasma reactors. An offset Δα in angle α between functions reactors detected. The then matched by performing them through equal Δα.
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