Plasma reactor with apparatus for dynamically adjusting the plasma source power applicator and the workpiece relative to one another
作者： Sheeba J. Panayil , Michael N. Grimbergen , Madhavi R. Chandrachood , Ibrahim M. Ibrahim , Ajay Kumar
DOI:
关键词:
摘要: A plasma reactor for processing a workpiece includes process chamber comprising an enclosure including ceiling and having vertical axis of symmetry generally perpendicular to said ceiling, support pedestal inside the facing gas injection apparatus coupled vacuum pump chamber. The further source power applicator overlying radially inner portion outer portion, RF portions, tilt capable tilting either or about radial rotating symmetry. In preferred embodiment, effecting axially symmetrical adjustments distribution, which may be (or both) elevation changing location portions relative one another along symmetry, apportioning levels applied portions.
lens.org 参考文章(11)
Tomohiro Okumura, Hideo Haraguchi, Takuya Matsui, Izuru Matsuda, Akio Mitsuhashi, Plasma processing method and apparatus ,(2004)
Sheeba J. Panayil, Michael N. Grimbergen, Madhavi R. Chandrachood, Ibrahim M. Ibrahim, Ajay Kumar, Renee Koch, Darin Bivens, Richard Lewington, Method of processing a workpiece in a plasma reactor with dynamic adjustment of the plasma source power applicator and the workpiece relative to one another ,(2006)
Sheeba J. Panayil, Michael N. Grimbergen, Madhavi R. Chandrachood, Ibrahim M. Ibrahim, Ajay Kumar, Renee Koch, Darin Bivens, Richard Lewington, Plasma reactor with a dynamically adjustable plasma source power applicator ,(2007)
John Patrick Holland, Michael S. Barnes, Vacuum plasma processor having coil with minimum magnetic field in its center ,(1996)
David Groechel, John Trow, Eric Askarinam, Kenneth Collins, Douglas Buchberger, Michael Rice, Raymond Hung, Joshua Tsui, Parallel plate electrode plasma reactor having an inductive antenna and adjustable radial distribution of plasma ion density ,(1997)
Valentin N. Todorow, John Holland, Michael Barnes, Plasma reactor having a symmetric parallel conductor coil antenna ,(2000)
John P. Holland, Tiqiang Ni, Wenli Collison, Plasma processor with coil having variable rf coupling ,(2000)
Susumu Hiraoka, Keizo Suzuki, Tetsuo Ono, Surface fabricating device ,(1991)
Ibrahim M. Ibrahim, Ajay Kumar, Richard Lewington, Michael N. Grimbergen, Sheeba J. Panayil, Renee Koch, Madhavi R. Chandrachood, Darin Bivens, Method of processing a workpiece in a plasma reactor employing a dynamically adjustable plasma source power applicator ,(2006)
Daniel J. Poindexter, George F. Cunningham, John W. Lewis, Robert B. McClure, RF Coupling techniques ,(1984)