Method of determining performance characteristics of polishing pads
作者： Kevin A. Keller , Gerald A. Whitman
DOI:
关键词: Semiconductor 、 Materials science 、 Mechanical engineering 、 Polishing 、 Wafer 、 Engineering drawing
摘要: A testing and analyzing method for determining the performance characteristics of a production lot polishing pads. The first step requires plurality semiconductor wafers with selected number pads from At least portion surface area each is divided into sites. one wafer characteristic site measured. incorporated discriminant function to predict by quantitative level data obtained polished
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