Sensors for a linear polisher
作者： Joseph R. Breivogel , Erik H. Engdahl , Anil K. Pant , Douglas W. Young , Rahul Jairath
DOI:
关键词:
摘要: A technique for utilizing sensors to monitor the polishing of a semiconductor wafer when linear polisher is utilized polish wafer. The are distributed along surface or coupled openings on-going process. sensed information from processed in order provide feedback compensating fluid dispensing platens used and/or downforce exerted by carrier.
lens.org 参考文章(14)
Humphreys Hugh, Pneumatic sanding pad ,(1921)
B Larson, Controller for fluid operated device ,(1972)
Gurtej S. Sandhu, Chris C. Yu, Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection ,(1991)
Eric Richard Wagner, Gabriel Lorimer Miller, In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection ,(1991)
Gurtej S. Sandhu, Laurence D. Schultz, Trung T. Doan, Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers ,(1990)
Michael D. Rostoker, Detecting the endpoint of chem-mech polishing, and resulting semiconductor device ,(1992)
Michael A. Leach, Edward J. Nowak, Brian J. Machesney, Device and method for detecting an end point in polishing operation ,(1992)
Laurence D. Schultz, Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer ,(1990)
Boguslaw A. Nagorski, David E. Weldon, Homayoun Talieh, Wafer polishing machine with fluid bearings ,(1994)
Carter W. Kaanta, Michael A. Leach, In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection ,(1988)