作者: Shu-Hsin Kao , Tim H. Huynh , David E. Weldon
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摘要: A polishing system such as a chemical mechanical belt polisher includes hydrostatic fluid bearing that supports pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding inlets in an array to extend areas elevated support pressure around inlets. Another modulates reverses flow reduce deviations time averaged induce vibrations improve performance. provides with cavity having lateral extent greater than object being polished. The depth bottom contour can be adjusted provide nearly uniform across area is surrounded by retaining ring support. Changing adjusts film thickness bearing. Yet another invention spiral partial cardiod drain grooves. This has non-uniform profile but average wafer rotated relative center constant at adjustable changing heights alter local thicknesses