作者: Christopher J. Case , Carlye B. Case
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摘要: A tool for the linear polishing of substrates includes an endless belt continuous strength wrapped substantially as a helix predetermined length and width with 180 degree twist along to increase by factor 2× time interval between which changes need be made because wear-and-tear, significantly reducing costs associated reduced down time. In preferred embodiment chemical-mechanical silicon wafer used in fabricating integrated circuits, is constructed Mobius strip rubberized, urethane composition flexible, but yet strong enough withstand applied pressure substrate.