System and method of automatically polishing semiconductor wafers

摘要: A method of automatically polishing a semiconductor wafer having substrate and surface film. mounting device, which may include vacuum chuck, holds the without requiring that have central aperture. The device are moved with an orbit-within-an-orbit motion while tape transport mechanism applies abrasive to film moving polish one flatness less than two microns. passes arcuately around roller between contacts in line running across width tape. system determines thickness during process real time measurement such as effipsometer, or by determining work-performed factor calculating estimated from factor. Finally, controls stop when achieves predefined planarization.