Automatic chemical and mechanical polishing system for semiconductor wafers

摘要: A system and method for chemically mechanically polishing a semiconductor wafer having substrate surface film. mounting device, which may include vacuum chuck, holds the without requiring that have central aperture. The device are moved with an orbit-within-an-orbit motion while tape transport mechanism applies abrasive to film of moving polish one flatness less than two microns. determines thickness during process real time measurement such as ellipsometer, or by determining work-performed factor calculating estimated from factor. Finally, automatically controls stop when achieves predefined planarization.