Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feed
作者： Wilbur Krusell , Glenn Travis , Ben Mooring , Erik Engdahl
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摘要: A method and apparatus are disclosed for chemically-mechanically polishing planarizing semiconductors. An includes first second rollers connected by a tension belt. member is releasably attached to the rollers. clamping portion of continuous strip roller, applying rotationally reciprocating while pressing semiconductor wafer against strip.
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