Abrasive construction for semiconductor wafer modification
作者： Denise R. Rutherford , Richard J. Webb , Douglas P. Goetz , William J. Hollywood , Cristina U. Thomas
DOI:
关键词:
摘要: An abrasive construction for modifying a surface of workpiece, such as semiconductor wafer. The comprises: three-dimensional, textured, fixed element; at least one resilient element generally coextensive with the and rigid interposed between element, wherein has Young's Modulus greater than that element.
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