摘要: Chemical-mechanical polishing (CMP) is used in integrated circuit manufacturing to remove material from patterned wafer surfaces. The term “polishing” or “planarization” describe two types of processes: 1) topography reduction surface features that result deposition, etch, other thin-film processes, and 2) removal (“polish back”) films leaving only desired recessed regions. later case also called a “damascene” “polish-back” CMP process.
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