Method and apparatus for post-polish thickness and uniformity control
作者： Christopher H. Raeder , Anthony J. Toprac , Alexander J. Pasadyn
DOI:
关键词: Polishing 、 Recipe 、 Process (computing) 、 Control theory 、 Layer (electronics) 、 Mechanical engineering 、 Control engineering 、 Control variable 、 Metrology 、 Wafer 、 Engineering
摘要: A method for polishing wafers includes providing a wafer having process layer formed thereon; tool plurality of control zones and being adapted to polish the based on an operating recipe, recipe variable corresponding each zones; measuring pre-polish thickness profile layer; comparing target determine desired removal profile; determining values variables associated with modifying determined variables. processing line tool, metrology controller. The is thereon recipe. zones. measure layer. controller compare profile, modify
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