Apparatus and method for controlling film thickness in a chemical mechanical planarization system
作者： Yehiel Gotkis
DOI:
关键词: Head (vessel) 、 Structural engineering 、 Materials science 、 Mechanical engineering 、 Polishing 、 Chemical-mechanical planarization
摘要: An apparatus for use in a chemical mechanical planarization (CMP) system is provided. A head capable of being positioned at proximate location over polishing pad includes an input and output defined the head. The delivering fluid on surface pad. oriented adjacent to removing least part delivered onto method controlling properties film also
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