Polishing pad conditioning system
作者： Stephen J. Benner , Robert Lyle Benner , Robert L. Benner
DOI:
关键词:
摘要: A system for conditioning rotatable polishing pads used to planarize and polish surfaces of thin film integrated circuits deposited on semiconductor wafer substrates, microelectronic, optical system. The has a pad apparatus, process fluids, vacuum capability pull waste material out the pad, self-contained flushing means, piezo-electric device vibrating apparatus.
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