Chemical-mechanical polishing pad conditioning system
作者： Jung-Hoon Chun , Thor Eusner , Nannaji Saka
DOI:
关键词: Radius of curvature (optics) 、 Chemical-mechanical planarization 、 Rotation 、 Composite material 、 Polishing 、 Materials science 、 Slurry 、 Optics
摘要: Polishing pad conditioning system. The system includes a first rotatable platen supporting polishing containing asperities having radius of curvature. A second supports disk bulk material holes therethrough, the supported for translation as well rotation. Means are provided pushing and into contact at an interface during rotation means passing slurry through in to whereby curvature is increased. Water may be delivered cooling. process also disclosed.
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