Apparatus and method for controlling fluid material composition on a polishing pad
作者： Danny Lim , Yehiel Gotkis
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摘要: An apparatus for use in a chemical mechanical planarization system is provided. The includes fluid displacing device and delivery device. capable of being positioned at proximate location over polishing pad, the configured to displace least part first from region pad. replacing displaced with second different than fluid. A method controlling properties film present pad surface also
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