Modular wafer polishing apparatus and method

摘要: A wafer polishing apparatus includes a module frame; continuous belt rotatable with respect to the frame, having at least one vertically-oriented transverse portion including pad assembly; and pivotable wafer-holding head drive within frame distal end movable vertical first position parallel juxtaposed portion. The carrier for holding on of drive, while moves held into abutting pressure is applied held-wafer against assembly rotated swept side-by-side. After reversed pivoted away from horizontal or other orientation then polished removed. Multiple modules may be placed end-to-end side-by-side robot pathway therebetween load unpolished wafers unload buffing station, cassette processing station.