作者: Peter D. Albrecht , George W. Greene , Rafael E. Hidalgo , Kenneth D. Strittmatter
DOI:
关键词:
摘要: An automated wafer lapping system including a robot (26; 404) which loads wafers (W) from cassette into carrier (136; 420) on machine (20; 400) one at time and after another. The is capable of delivering lapped to thickness gauging device (38) for measuring the recalibrating between each run. Openings (160; 418) in carriers receiving are sized closely minimal relative motion 420). A centering jig (30; 416) search program facilitate fast location openings 418). also inspects defects sorts them accordingly lapping.