Surface grinding machine and carrier used therefor

作者: Shunji Hakomori

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摘要: In order to take a ground work W out of work-holding hole carrier by chucking the outer periphery W, surface grinding machine is provided with means for plurality claw members and cutouts into which can be inserted are made in edge carrier, taken at position cutouts.

参考文章(3)
Peter D. Albrecht, George W. Greene, Rafael E. Hidalgo, Kenneth D. Strittmatter, Automated wafer lapping system ,(1997)
Hiromasa Hashimoto, Fumihiko Hasegawa, An automatic wafer lapping apparatus ,(1991)
Masanori Furukawa, Satoru Kitta, Polishing machine and a method of polishing a work ,(1994)