Chemical mechanical planarization system
作者： Manoocher Birang , Paul D. Butterfield , Philip R. Sommer
DOI:
关键词: Mechanical engineering 、 Polishing 、 Chemical-mechanical planarization 、 Structural engineering 、 Head (vessel) 、 Engineering 、 Wafer
摘要: A semiconductor wafer processing system, more specifically, a chemical mechanical planarization system including polishing media reconditioning system. In one embodiment, the comprises at least first and second conditioning roller that contact working surface of while rotating in opposite directions. Other embodiments include plates disposed on carrier includes head, or disk traverses conditions retained head. Alternatively, may be conditioned utilizing devices embodied above remotely from
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