A method and apparatus for stabilizing the process temperature during chemical mechanical polishing

摘要: A temperature compensating unit (40) is coupled to a linearly moving belt (12) of polisher (10) for adjusting the (12), which measured by sensor (41) situated proximal (12). One sequence operation performing CMP as follows. The turned on and engaged initiation polishing cycle. Acquisition center line begins with sending data processor (40). boiler brought up desired operating temperature, if not already at temperature. valve (32) opened inject steam through manifold (28) heat belt/pad assembly. commences increase this monitored (41). Then when centerline reaches point, closed heating disengaged. At wafer processing (10).