In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection
作者： Carter W. Kaanta , Michael A. Leach
DOI:
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摘要: An apparatus and method for monitoring the conductivity of a semiconductor wafer during course polishing process. A pad that contacts has an active electrode at least one passive electrode, both which are embedded in pad. detecting device is connected to electrodes current between as lapped by The etch endpoint determined function magnitude flow.
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