Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
作者： Gurtej S. Sandhu , Laurence D. Schultz , Trung T. Doan
DOI:
关键词: Chemical-mechanical planarization 、 Electric motor 、 Wafer 、 Semiconductor 、 Electronic engineering 、 Planar 、 Optoelectronics 、 Materials science 、 Wafer backgrinding 、 Polishing 、 Signal
摘要: A method and apparatus for detecting a planar endpoint on semiconductor wafer during chemical/mechanical planarization of the wafer. The is detected by sensing change in friction between polishing surface. This may be produced when, instance, an oxide coating removed harder material contracted In preferred form invention, rotating surface with electric motors measuring current changes one or both motors. can then used to produce signal operate control means adjusting stopping process.
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