作者: Erwan Godot , Amaud Favre , Remi Thollot
DOI:
关键词: Vacuum pump 、 Process engineering 、 Semiconductor 、 Foreign Bodies 、 Materials science
摘要: The aim of the invention is to provide a method for treatment transport support ( 1 ) conveyance and storage semiconductor substrates, with said possibly having first undergone cleaning operation using liquid. includes stage in which placed sealed chamber 4 connected vacuum pump 5 subjected combined action subatmospheric pressure infrared radiation favor removal foreign bodies on walls ). also concerns station implementation method.