Diplexer design using through glass via technology
作者： David F Berdy , Puay H See , Chengjie Zuo , Changhan Yun , Robert P. Mikulka
DOI:
关键词: Engineering 、 Diplexer 、 Electrical engineering 、 Optoelectronics 、 Capacitor 、 Substrate (printing) 、 Inductor
摘要: A diplexer includes a substrate having set of through vias. The also first traces on surface the substrate. are coupled to further second that is opposite surface. ends vias and operate as 3D inductor. capacitor supported by
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