3d rf l-c filters using through glass vias
作者： Chi Shun Lo , Chengjie Zuo , Changhan Yun , Jonghae Kim , Mario F. Velez
DOI:
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摘要: Three-dimensional (3D) Radio Frequency (RF) inductor-capacitor (LC) band pass filters having through-glass-vias (TGVs). One such L-C filter circuit includes a glass substrate, first portion of inductor formed on surface the second and set TGVs configured to connect portions inductor. Additionally can include similar inductor, metal-insulator-metal (MIM) capacitor between that are coupled through MIM capacitor.
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