Discrete three-dimensional memory
作者： Guobiao Zhang
DOI:
关键词: Computer hardware 、 Die (integrated circuit) 、 Dice 、 Topology 、 Component (UML) 、 Plane (geometry) 、 Engineering
摘要: The present invention discloses a discrete three-dimensional memory (3D-M). It is partitioned into at least two dice: memory-array die and peripheral-circuit die. comprises 3D-M array, which built in 3-D space. component, on 2-D plane. At one component of the formed instead array efficiency can be larger than 70%.
google.de 参考文章(74)
Oda Katsuya, Washio Katsuyoshi, Method of manufacturing a semiconductor device ,(2006)
Hojun Shim, Kijo Jung, Seung-Duk Cho, Nonvolatile memory device and operating method thereof ,(2012)
Howard L. Kalter, Claude L. Bertin, Stacked double dense read only memory ,(1984)
Paul-Werner von Basse, Doris Schmitt-Landsiedel, Roland Thewes, Michael Bollu, Multi-value read-only memory cell having an improved signal-to-noise ratio ,(1996)
Bruce B. Roesner, Method of fabricating a high density masked programmable read-only memory ,(1987)
Bruce Boyd Roesner, Mask programmable read-only memory stacked above a semiconductor substrate ,(1981)
Mark G. Johnson, Three-dimensional, mask-programmed read only memory ,(2001)
Luca Fasoli, Gopinath Balakrishnan, Jeffrey Koon Yee Lee, Tz-yi Liu, Yuheng Zhang, Page register outside array and sense amplifier interface ,(2009)
Robert Norman, Solid state drive with non-volatile memory for a media device ,(2008)
Roy E. Scheuerlein, James M. Cleeves, Optimization of critical dimensions and pitch of patterned features in and above a substrate ,(2008)