Design and Fabrication of MOSFETs with a Reverse Embedded SiGe (Rev. e-SiGe) Structure

作者: Ricardo A. Donaton , Dureseti Chidambarrao , Jeff Johnson , Paul Chang , Yaocheng Liu

DOI: 10.1109/IEDM.2006.346813

关键词: Materials scienceOptoelectronicsUniaxial tensionRelaxation (NMR)FabricationStress (mechanics)Electronic engineeringStrain (chemistry)MOSFETTensile strainStrain engineering

摘要: A novel device structure containing a SiGe stressor is used to impose tensile strain in nMOSFET channel. 400MPa of uniaxial stress induced the Si channel through elastic relaxation/strain SiGe/Si bi-layer structure. This results 40% mobility enhancement and 15% drive current improvement for sub-60nm devices compared control with no strain.

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