作者: Shi Xin
DOI:
关键词: Process (computing) 、 Machining 、 Manipulator 、 Substrate (printing) 、 Semiconductor 、 Production efficiency 、 Bearing (mechanical) 、 Optoelectronics 、 Materials science
摘要: The present invention provides a chamber and semiconductor machining equipment. includes substrate box bearing device, heating device vacuum/atmosphere switching device. is used for box. substrates in the so as to realize degassing process of substrates. environment between vacuum state atmosphere during loading onto therein Based on chamber, not only transferring cavity by means manipulator saved, but also production efficiency improved. Moreover, equipment provided with above arrangement an extra that cost occupied area are reduced.