Transport of chemically active species in plasma reactors for etching

作者: V Martisovits , M Zahoran

DOI: 10.1088/0963-0252/6/3/005

关键词: Etching (microfabrication)AluminiumDiffusion (business)PlasmaChemistryChlorineFluxPlanarAnalytical chemistryReactive-ion etching

摘要: The one-dimensional transport of the neutral reactive species in planar reactor is studied theoretically to draw conclusions on performance at maximum etching rate. rate calculated as a function reactant flux entering for various densities desorbing product from etched surface. An influence mutual diffusion and shown together with respective concentrations reaction reactor. theory compared experimental results corresponding aluminium by chlorine. A method situ monitoring uniformity also presented.

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