Off-Angle SiC(0001) Surface and Cu/SiC Interface Reaction

作者: Katsumi Nishimori , Heizo Tokutaka , Shuuichi Nakanishi , Satoru Kishida , Naganori Ishihara

DOI: 10.1143/JJAP.28.L1345

关键词: Surface reconstructionReaction interfaceAnalytical chemistryMineralogyInorganic compoundAuger electron spectroscopySilicideAnnealing (metallurgy)Surface structureLow-energy electron diffractionMaterials scienceGeneral EngineeringGeneral Physics and Astronomy

摘要: An off-angle SiC(000)C surface showed an (1×1) LEED pattern. It was very different compared with the just angle surfaces of and SiC(0001)Si where they (3×3) (√3× √3)R30° patterns, respectively. A 5° can be cleaned by thermal annealing at 1000°C. Some silicide formations were observed from system Cu/SiC 200–300°C, but Au/SiC does not show any reactions.

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