作者: Shinichi Konno , Hidefumi Fujita , Kimitaka Sato , Toshihiko Ueyama
DOI:
关键词: Substrate (electronics) 、 Materials science 、 Volume (thermodynamics) 、 Particle 、 Dispersion (chemistry) 、 Electrical resistivity and conductivity 、 Flexography 、 Silver particles 、 Composite material 、 Electrical conductor
摘要: A silver conductive film that enables the mass production of a circuit such as an antenna for IC tags having excellent electrical characteristics and bendability at low cost by producing which contains 10-50% volume sintered particles has resistivity 3-100 μΩ·cm, surface 0.5 Ω/□ or less thickness 1-6 μm applying particle dispersion liquid containing 50-70% average diameter 20 nm to substrate flexography then firing resulting substrate.