Low-temperature sintering conductive paste, conductive film using same, and method for forming conductive film

摘要: When a substrate having low heat resistance is used, treatment at approximately 120° C. which deformation does not occur desirable. achieved regardless of the type resin used for conductive paste, flexible design paste possible according to purposes, and fields could be applied are expanded. Thus, capable forming film exhibiting high conductivity even temperatures whether constituting thermosetting or thermoplastic provided. In method film, in dicarboxylic acid 2 8 carbon atoms added including silver nanoparticles coated with an organic substance 6 atoms, dispersion medium, used.