Preparation of thin film resistors with low resistivity and low TCR by heat treatment of multilayered Cu/Ni deposits
作者： Hidehiko Enomoto , Naohiro Mikamoto , Tsuneshi Nakamura , Masao Matsuoka , Chiaki Iwakura
DOI: 10.1016/S0257-8972(98)00682-3
关键词: Materials science 、 Temperature coefficient 、 Composite material 、 Alloy 、 Electrical resistivity and conductivity 、 Copper 、 Plating 、 Thermal stability 、 Mineralogy 、 Resistor 、 Thin film
摘要: Abstract Thin Cu–Ni alloy film resistors were prepared by different methods using both electroless plating and electrodeposition. Alloy composition, structure electrical properties (resistivity TCR) examined as a function of conditions. Low resistivity low TCR performance achieved heating the multilayered Cu/Ni deposited on Cu.
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