The dynamics of radiation blistering and near‐surface deuterium retention in deuteron‐irradiated copper
作者： P. B. Johnson , T. R. Armstrong
DOI: 10.1063/1.89687
关键词: Irradiation 、 Deuterium 、 Radiation 、 Fluence 、 Blisters 、 Copper 、 Atomic physics 、 Scattering 、 Materials science 、 Ion implantation
摘要: The effect of radiation blistering on the retention deuterium in near‐surface region 200‐keV d+ irradiated Cu at 350 K has been studied. Blistering is detected using an situ method based scattering laser light. incident deuteron beam used both for implantation and to obtain dynamic depth profile. Discrete blisters approximately 4‐μm average diameter are found form rapidly a well‐defined fluence (7±1) ×1018d+/cm2. rate accumulates first 0.4 μm fall dramatically onset from steady value, ∼2% rate, nearly zero. Typical D : Cu loadings critical dose ∼1 at.%.
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