A flexible polyimide-based package for silicon sensors
作者： David J. Beebe , Denice D. Denton
DOI: 10.1016/0924-4247(93)00775-Y
关键词: Reliability (semiconductor) 、 Forensic engineering 、 Epoxy 、 Polyimide 、 Test setup 、 Optoelectronics 、 Materials science 、 Fabrication 、 Hydrofluoric acid 、 Silicon 、 Lead (electronics)
摘要: Abstract This paper describes the development of a flexible polyimide-based package for silicon sensors. The fabrication process is compatible with standard integrated-circuit processes and produces that sandwiches metal leads between polyimide layers. Polyimide (DuPont PI-2611) found to be resistant isotropic etchant (hydrofluoric acid/nitric acid) used realize sensing islands. Factors affecting reliability, which include lead layout, island size support material at silicon/polyimide interface, are identified investigated. Packages tested in an automated test setup on human subjects. A factor three increase width two-fold reliability. use epoxy as rigid 50-fold reliability
elsevier.com
sci-hub.se 参考文章(9)
A.S. Laskar, S. Blythe, Epoxy multichip modules: A solution to the problem of packaging and interconnection of sensors and signal-processing chips Sensors and Actuators A: Physical. ,vol. 36, pp. 1- 27 ,(1993) , 10.1016/0924-4247(93)80136-5
J.F. Hetke, K. Najafi, K.D. Wise, Flexible miniature ribbon cables for long-term connection to implantable sensors Sensors and Actuators A: Physical. ,vol. 23, pp. 999- 1002 ,(1990) , 10.1016/0924-4247(90)87076-U
Khalil Najafi, Integrated sensors in biological environments Sensors and Actuators B: Chemical. ,vol. 1, pp. 453- 459 ,(1990) , 10.1016/0925-4005(90)80248-X
P. Dario, Tactile sensing: Technology and applications Sensors and Actuators A: Physical. ,vol. 26, pp. 251- 256 ,(1991) , 10.1016/0924-4247(91)87001-J
P.W. Barth, S.L. Bernard, J.B. Angell, Flexible circuit and sensor arrays fabricated by monolithic silicon technology IEEE Transactions on Electron Devices. ,vol. 32, pp. 1202- 1205 ,(1985) , 10.1109/T-ED.1985.22101
Lyn Bowman, James D. Meindl, The Packaging of Implantable Integrated Sensors IEEE Transactions on Biomedical Engineering. ,vol. BME-33, pp. 248- 255 ,(1986) , 10.1109/TBME.1986.325807
M. J. Vasile, B. J. Bachman, Aluminum deposition on polyimides: The effect of in situ ion bombardment Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. ,vol. 7, pp. 2992- 2997 ,(1989) , 10.1116/1.576305
Harry Robbins, Bertram Schwartz, Chemical Etching of Silicon Journal of The Electrochemical Society. ,vol. 106, pp. 505- None ,(1959) , 10.1149/1.2427397
Joseph T. Kung, Andrew N. Karanicolas, Hae-Seung Lee, A compact, inexpensive apparatus for one-sided etching in KOH and HF Sensors and Actuators A: Physical. ,vol. 29, pp. 209- 215 ,(1991) , 10.1016/0924-4247(91)80017-J