Epoxy multichip modules: A solution to the problem of packaging and interconnection of sensors and signal-processing chips
作者： A.S. Laskar , S. Blythe
DOI: 10.1016/0924-4247(93)80136-5
关键词:
摘要: Abstract The demand for high efficiency and reliability from miniaturized sensor systems is directing research development towards integrated sensors with as much electronic signal conditioning on the chip possible. However, technological constraints do not always allow reliable cost-effective signal-conditioned to be fabricated. Another stumbling block in advance of lack a simple effective encapsulation, packaging interconnection technology. This situation worse chemical, biological biomedical sensors, since very nature these requires that their sensing elements should direct contact chemical or analyte, which an point view constitutes hostile environment. paper looks into possibility combined solution problems using system-level approach multichip module. Also, it presents novel epoxy module fabrication technology integration signal-processing chips.
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