Packaging Materials and Techniques for Implantable Instruments
作者： Wen H. Ko , Thomas M. Spear
DOI: 10.1109/EMB-M.1983.5005879
关键词: Frequency modulation 、 Bandwidth (signal processing) 、 Electronic circuit 、 Surface impedance 、 Encapsulation (networking) 、 Automatic frequency control 、 Materials science 、 Electrical engineering 、 Electronic engineering 、 Biological materials
摘要:
sci-hub.se 参考文章(12)
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