作者: Minoru Fujishima , Mizuki Motoyoshi , Kosuke Katayama , Kyoya Takano , Naoko Ono
DOI: 10.1109/JSSC.2013.2261192
关键词: Frequency band 、 Extremely high frequency 、 Chipset 、 D band 、 Electronic engineering 、 Transceiver 、 Wireless 、 CMOS 、 Engineering 、 Data rate units
摘要: Recently, short-distance high-speed wireless communication using a 60 GHz band has been studied for mobile application. To realize higher-speed while maintaining low power consumption application D (110-170 GHz) is promising since it can potentially provide wider frequency band. Thus, we have D-band CMOS circuits to low-power ultrahigh-speed communication. In the band, however, no sufficient device model provided, research generally start from modeling. this paper, design procedure overviewed layer system layer, where architecture optimized both and high data transfer rate. Finally, 10 Gbps transceiver with of 98 mW demonstrated 135