Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

摘要: In one embodiment, a semiconductor device includes substrate having first surface, and second surface opposite to the surface. The defines redistribution trench. has via hole extending therethrough. also through disposed in hole. may include insulating layer, barrier sequentially formed on an inner wall of further conductive connector adjacent layer. additionally insulation layer pattern substrate. opening that exposes region top via. devices trench electrically connected overlaps connector.