Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
作者： David Pratt
DOI:
关键词: Optoelectronics 、 Structural engineering 、 Layer (electronics) 、 Integrated circuit 、 Redistribution layer 、 Substrate (printing) 、 Electrical contacts 、 Electrical conductor 、 Trench 、 Engineering
摘要: A method of making a semiconductor die includes forming trench around conductive stud extending from the first side to second substrate expose portion and then layer inside in electrical contact with stud.
lens.org 参考文章(24)
David R. Hembree, Alan G. Wood, Method for fabricating semiconductor components ,(2001)
Edward Cooney, Anthony Stamper, Andrew Simon, Jeffrey Gambino, Michael Lane, William Thomas Motsiff, Dual damascene interconnect structures having different materials for line and via conductors ,(2007)
Chen-Hua Yu, Jui-Yu Chang, Syun-Ming Jang, Ying-Ho Chen, Method of photo alignment for shallow trench isolation with chemical mechanical polishing ,(1998)
Warren M. Farnworth, William M. Hiatt, Steven M. McDonald, Nishant Sinha, Methods of fabricating substrates including at least one conductive via ,(2007)
Mitsutoshi Higashi, Kei Murayama, Semiconductor device and method of production of same ,(2002)
David Corisis, Walter Moden, Interconnect for packaging semiconductor dice and fabricating BGA packages ,(1998)
John Thomas Maddix, David Paul Vallett, Paul Joseph Pikna, Anthony Michael Palagonia, Micro probe ring assembly and method of fabrication ,(1997)
Mark Hiatt, Kyle K. Kirby, David R. Hembree, Warren M. Farnworth, James M. Wark, Sidney B. Rigg, Alan G. Wood, Charles M. Watkins, Steven D. Oliver, Lu Velicky, Mark E. Tuttle, Salman Akram, Through-wafer interconnects for photoimager and memory wafers ,(2010)
Low Siu Waf, Chua Swee Kwang, Chia Yong Poo, Neo Yong Loo, Chan Min Yu, Boon Suan Jeung, Wafer level stackable semiconductor package ,(2001)
Leonel R. Arana, Devendra Natekar, Michael Newman, Charan K. Gurumurthy, Method of forming through-silicon vias with stress buffer collars and resulting devices ,(2005)