Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same

摘要: A semiconductor package includes a chip provided with bonding pad disposed over surface thereof; through electrode passing from the to second opposing first and connected electrically pad; redistribution at electrode. An embodiment of present invention is capable significantly reducing thickness volume package. It also high speed operation since path signal inputted and/or outputted shortened. stacking easily least two packages having wafer level, it parasitic capacitance.