Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

摘要: Microelectronic devices, methods for packaging microelectronic and forming vias conductive interconnects in microfeature workpieces dies are disclosed herein. In one embodiment, a method includes bond-pad on die having an integrated circuit, the being electrically coupled to circuit. A line is then formed die, first end portion attached second spaced apart from bond-pad. The can further include via or passage through bond-pad, of line, depositing material at least form interconnect extending generally device.