Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs and processes for preparing such printed circuit wiring boards

作者: Robert J. Minchak , Timothy J. Kettering , David J. Smith , Linwood P. Tenney , George M. Benedikt

DOI:

关键词: Printed circuit boardPolymerComposite materialMaterials scienceSubstrate (printing)Copolymer

摘要: Copolymers for use in preparing prepregs, which turn are used to prepare printed circuit wiring boards provided, as well processes producing the prepregs and boards. The copolymers comprise repeating units derived from cycloolefin monomers, e.g., norbornene-type dicyclopentadiene-type monomers. Some of monomers silane-substituted while others non silane-substituted. provide exhibit improved properties when employed For example, adhesion is achieved between noncellulosic substrate polymers components These include, but not limited dielectric properties, glass cloth substrates, etc.

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