Organosilane adhesion promotion in manufacture of additive printed wiring board

摘要: The metal (for example, copper) to base material adhesion in an additive printed wiring board is improved by contacting the with a solution containing ureidosilane, preferably also comprising disilyl crosslinking agent, followed drying remove solvent, before activating agent for electroless deposition step. Heating of board, after metal, example baking oven or autoclave, gives highest level between and material.