Method and system for locally sealing a vacuum microcavity, methods and systems for monitoring and controlling pressure and method and system for trimming resonant frequency of a microstructure therein
作者： Patty P. L. Chang-Chien , Kensall D. Wise
DOI:
关键词: Trimming 、 Control methods 、 Monitoring and control 、 Microstructure 、 Base (geometry) 、 Signal 、 Optoelectronics 、 Materials science
摘要: A method and system for locally sealing a vacuum microcavity, methods systems monitoring controlling pressure in the microcavity trimming resonant frequency of microstructure are provided. The has an initial base therein after is sealed at access passageway. control include measuring providing signal when exceeds maximum desired level. also includes reducing to or below level response compensate degradation within microcavity.
google.nl 参考文章(11)
Clark T.-C. Nguyen, Kun Wang, Method and system for locally annealing a microstructure formed on a substrate and device formed thereby ,(1998)
Eric Beyne, Myriam Van de Peer, Hendrikus A. C. Tilmans, Method of fabrication of a microstructure having an internal cavity ,(1999)
H. Henmi, S. Shoji, Y. Shoji, K. Yoshimi, M. Esashi, Vacuum packaging for microsensors by glass-silicon anodic bonding Sensors and Actuators A-physical. ,vol. 43, pp. 243- 248 ,(1994) , 10.1016/0924-4247(94)80003-0
Eniko T Enikov, James G Boyd, Electroplated electro-fluidic interconnects for chemical sensors Sensors and Actuators A-physical. ,vol. 84, pp. 161- 164 ,(2000) , 10.1016/S0924-4247(99)00322-2
Yuelin Wang, M. Esashi, The structures for electrostatic servo capacitive vacuum sensors Sensors and Actuators A-physical. ,vol. 66, pp. 213- 217 ,(1998) , 10.1016/S0924-4247(98)00037-5
Y.T. Cheng, L. Lin, K. Najafi, Localized bonding with PSG or indium solder as intermediate layer international conference on micro electro mechanical systems. pp. 285- 289 ,(1999) , 10.1109/MEMSYS.1999.746837
H. Guckel, D.W. Burns, Planar processed polysilicon sealed cavities for pressure transducer arrays international electron devices meeting. ,vol. 30, pp. 223- 225 ,(1984) , 10.1109/IEDM.1984.190686
Y.T. Cheng, Liwei Lin, K. Najafi, Fabrication and hermeticity testing of a glass-silicon package formed using localized aluminum/silicon-to-glass bonding international conference on micro electro mechanical systems. pp. 757- 762 ,(2000) , 10.1109/MEMSYS.2000.838613
Khalil Najafi, Liwei Lin, Kensall D. Wise, Yu-Ting Cheng, Process for making microstructures and microstructures made thereby ,(1998)
John Liebeskind, Electronic device sealed under vacuum containing a getter and method of operation ,(2002)