Contact for a semiconductor light emitting device

作者: John E. Epler , Aurelien J.F. David

DOI:

关键词: OptoelectronicsSemiconductor structureLight emitting deviceMaterials scienceConductive materialsSemiconductorLayer (electronics)Electrical conductor

摘要: Embodiments of the invention include a semiconductor structure comprising III-nitride light emitting layer disposed between an n-type region and p-type region. A contact on includes transparent conductive material in direct with region, reflective metal layer, insulating layer. In plurality openings material, is

参考文章(122)
Tzer-Perng Chen, Kuang-Neng Yang, Chih-Sung Chang, Light emitting diode with low-temperature solder layer ,(2000)
Kazuyuki Yamae, Hiroshi Fukshima, Masaharu Yasuda, Tomoya Iwahashi, Akihiko Murai, Semiconductor light emitting element and illuminating apparatus using the same ,(2009)
Atsuo Michiue, Tomonori Morizumi, Hiroaki Takahashi, Nitride semiconductor laser element ,(2008)
Kyoung-Kook Kim, Woong-ki Hong, Tae-yeon Seong, June-o Song, Flip-chip light emitting diodes and method of manufacturing thereof ,(2005)
Andreas Weimar, Berthold Hahn, Johannes Baur, Glenn-Ives Plaine, Matthias Sabathil, Thin-Film LED Having a Mirror Layer and Method for the Production Thereof ,(2008)