作者: Antonio R. Arellano-Lopez , Arturo Dominguez-Rodriguez , Kenneth C. Goretta , Jules L. Routbort
DOI: 10.1111/J.1151-2916.1993.TB03921.X
关键词: Creep 、 Stress (mechanics) 、 Diffusion creep 、 Deformation (engineering) 、 Stress concentration 、 Grain Boundary Sliding 、 Materials science 、 Whisker 、 Metallurgy 、 Composite material 、 Grain boundary
摘要: SiC-whisker-reinforced Al[sub 2]O[sub 3] samples (SiC[sub w]/Al[sub 3]), obtained from three different manufacturers, containing 0-30 vol% SiC have been crept under compression at 1,400 C in flowing argon. Compressive creep tests and microstructural observations used to characterize the plastic deformation mechanisms. The presence of whiskers decreased rate by reducing grain-boundary sliding. Damage formation was increased, however, because acted as stress concentration sites. For specimens with whisker loadings greater than 15%, absolute not strongly dependent on concentration, cavitation damage negligible below a critical that depended fabrication procedure specimen. This regime characterized exponent approximately 1, which occurred primarily diffusional flow. materials less SiC, grain boundary