A Comparative Study of Placement of Processor on Silicon and Thermal Analysis
作者： C. Ramya Menon , Vinod Pangracious
DOI: 10.1007/978-3-642-27308-7_69
关键词: Computer science 、 Silicon 、 Thermal analysis 、 Computer hardware 、 Idle 、 Thermal management of electronic devices and systems 、 Floorplan 、 Integrated circuit 、 Through-silicon via 、 Electrical engineering 、 Multi-core processor
摘要: Today when we have stepped into the second decade of this century, integrated circuits are getting more and complex with multicore processors. With technology scaling, devices being a small area. As result, heat dissipation in (ICs) has increased. The processor is one highest generating components an IC. temperature generated circuit varies factors like number processors, modes, their dimensions arrangement on Silicon. In paper presenting two simulation results. First was obtained by analyzing how area occupied affects distribution. This study extremely important as processors scales down technology. to find out location modes can affect distribution at 2.4GHz frequency were analyzed both active idle modes. lowest temperatures hotspot each case analyzed.
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