Bonding member, semiconductor device and method for manufacturing the same, circuit board, and electronic equipment
作者： Hideo Miyasaka , 英男 宮坂
DOI:
关键词: Semiconductor device 、 Substrate (printing) 、 Electrical connection 、 Printed circuit board 、 Interconnection 、 Layer (electronics) 、 Electronic equipment 、 Filler (packaging) 、 Optoelectronics 、 Materials science
摘要: PROBLEM TO BE SOLVED: To provide a bonding member which exerts excellent electric connection, semiconductor device and method for manufacturing the same, circuit board, electronic equipment. SOLUTION: The is provided with chip 20 having bumps 22, substrate 30 facing 20, on interconnection patterns 32 are formed electrical connection to 10 first layer 11 comprising an insulating filler (e.g. silica 14) second 12 without filler. located between 30. portions 22 positioned inside of 10.
lens.org 参考文章(0)